EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.

EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

The group attached the GaInP/GaInAsP top structure to the TOPCon devices by using surface-activated direct wafer bonding. They then implemented rear-side grating through nanoimprint lithography.

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...