TSMC operates four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, TSMC Washington in the United States, and TSMC China Company Limited.

Maintaining reliable production capacity is a key manufacturing strategy at TSMC. The Company currently operates four 12-inch GIGAFAB® facilities – Fab 12, 14, 15 and 18. The combined capacity of the four facilities exceeded 12 million 12-inch wafers in 2023.

Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2024.

TSMC estimates that Fab 12, Phases 4 and 5 and Fab 15, Phases 3 and 4 will conserve 50 million kilowatt-hours of electricity and eliminate 30,000 tons of carbon emissions per year in 2012 following adoption of ISO 50001 standards.

Dec 3, 2024 · On November 26, TSMC held an equipment installation ceremony for its new 2nm fab in Kaohsiung, marking the company’s first 12-inch wafer fab in Kaohsiung, Taiwan. This milestone signals TSMC’s transition from construction to production. The Kaohsiung 2nm fab is preparing for mass production in 2025.

TSMC Fab12 has produced SRAM chips using the company’s industry-leading, all-copper, 0.13-micron logic process with yields comparable to TSMC’s 8-inch fabs. This milestone makes TSMC the first foundry to deliver a 0.13-micron process in a 300mm manufacturing environment, and the first to yield at production-worthy levels.

TSMC currently operates two 300-mm GIGAFAB™ facilities (Fabs 12 and Fab 14). Part of the capacity is reserved for research and development work and currently...

Located in Taiwan's Hsinchu Science-based Industrial Park, Fab 12 is producing Etron Technology's 8Mb SRAM as well as Logic and SRAM test chips for TSMC's evaluation with its leading 0.15um technology.

As of June 2023, this technology has been implemented in the Fab 18 Phase 4 manufacturing facility, saving 6.5 million kWh of electricity and reducing 3,300 metric tons of carbon emissions. The Fab 12 Phase 8, Fab 18 Phases 5 and 6, and Advanced Backend Fab 6A facilities are currently also implementing these improvements to enhance TSMC's ...

TSMC currently operates three 12-inch GIGAFAB™ fabrication facilities – Fab 12, Fab 14, and Fab 15 – whose combined capacity reached 3,936,000 12-inch wafers in 2012. Production within these three facilities supports 0.13μm, 90nm, 65nm, 40nm, 28nm, and 20nm process technologies, and their sub-nodes.